本期專利主題：蘋果公司-智慧型行動裝置與智慧型穿戴裝置專利
蘋果公司（英語：Apple Inc.）在台發表專利(2021/01/01~2022/03/15)
| 流水號 | 專利名稱(中文/英文) | 狀態(已通過/審核中)與專利公開連結 | 申請/專利通過日期 | |
| TW110143649 | 無承載體架構之用戶設備、方法以及基頻處理器 USER EQUIPMENT, METHOD, AND BASEBAND PROCESSOR OF A BEARER-LESS ARCHITECTURE | 已通過 | 2022/03/01 | |
| TW110117657 | 改善封裝翹曲及可靠性之混合熱介面材料及低溫焊接圖案 HYBRID THERMAL INTERFACE MATERIAL AND LOW TEMPERATURE SOLDER PATTERNS TO IMPROVE PACKAGE WARPAGE AND RELIABILITY | 已通過 | 2022/03/01 | |
| TW110139980 | ＩＰ多媒體子系統（ＩＭＳ）的緊急通話路由安排技術 IMS EMERGENCY CALL ROUTING TECHNIQUES | 已通過 | 2022/02/16 | |
| TW110128467 | 使用替代結果之記憶體子系統校準 MEMORY SUBSYSTEM CALIBRATION USING SUBSTITUTE RESULTS | 已通過 | 2022/02/16 | |
| TW110133335 | 使用光子焊接技術之電子總成及其組裝方法 ELECTRONIC ASSEMBLY USING PHOTONIC SOLDERING AND THE METHOD OF ASSEMBLING THE SAME | 已通過 | 2022/01/01 | |
| TW110133182 | 半導體封裝基材精細節距金屬凸塊及強化結構 SEMICONDUCTOR PACKAGING SUBSTRATE FINE PITCH METAL BUMP AND REINFORCEMENT STRUCTURES | 已通過 | 2021/12/16 | |
| TW110130100 | 用於經由導線形式附接機構耦接之耳塞套 EARTIPS FOR COUPLING VIA WIREFORM ATTACHMENT MECHANISMS | 已通過 | 2021/12/16 | |
| TW110116871 | 具有增強之輕負載管理的高效能二級電源轉換器 HIGH PERFORMANCE TWO STAGE POWER CONVERTER WITH ENHANCED LIGHT LOAD MANAGEMENT | 已通過 | 2021/12/16 | |
| TW110113097 | 封閉體與一或多個佔用者之間的互動 INTERACTION BETWEEN AND ENCLOSURE AND ONE OR MORE OCCUPANTS | 已通過 | 2021/12/16 | |
| TW110104737 | 多晶片模組溝槽化蓋及低熱膨脹係數加強環 MULTIPLE CHIP MODULE TRENCHED LID AND LOW COEFFICIENT OF THERMAL EXPANSION STIFFENER RING | 已通過 | 2021/12/16 | |
| TW110125693 | 具有矽及半導電性氧化物薄膜電晶體之顯示器及顯示像素 DISPLAYS WITH SILICON AND SEMICONDUCTING OXIDE THIN-FILM TRANSISTORS AND DISPLAY PIXEL | 已通過 | 2021/11/16 | |
| TW110103472 | 視訊寫碼中之色度量化 CHROMA QUANTIZATION IN VIDEO CODING | 已通過 | 2021/11/16 | |
| TW110125839 | 系統級封裝及系統級封裝的組裝方法 SYSTEM-IN-PACKAGE AND METHOD OF ASSEMBLY OF A SYSTEM-IN-PACKAGE | 已通過 | 2021/11/01 | |
| TW110104765 | 用於增強晶圓製造之系統及方法 SYSTEMS AND METHODS FOR ENHANCED WAFER MANUFACTURING | 已通過 | 2021/10/01 | |
| TW110107267 | 在多重波束操作中之控制發訊技術 CONTROL SIGNALING IN MULTIPLE BEAM OPERATION | 已通過 | 2021/09/16 | |
| TW110115887 | 具有充電系統之耳塞盒 EARBUD CASE WITH CHARGING SYSTEM | 已通過 | 2021/09/01 | |
| TW110104140 | 高密度3D互連構形 HIGH DENSITY 3D INTERCONNECT CONFIGURATION | 已通過 | 2021/09/01 | |
| TW110115117 | 用於驗證對安全裝置功能性之線上存取之方法 METHODS FOR VALIDATING ONLINE ACCESS TO SECURE DEVICE FUNCTIONALITY | 已通過 | 2021/08/16 | |
| TW110106223 | 半導體封裝及其形成之方法 SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | 已通過 | 2021/08/16 | |
| TW110103515 | 具有固定路由的網路架構 NETWORK ARCHITECTURE WITH FIXED ROUTING | 已通過 | 2021/07/16 |
