活動日期 / Date: 2025/10/16 09:30 ~ 12:30
活動內容 / Event Details:
輕量化AI技術與半導體應用創新國際研討會
Innovation for Lightweight AI: Technology and Applications
輕量化AI技術與半導體應用創新國際研討會/Innovation for Lightweight AI: Technology and Applications係由 TIARA(臺灣半導體產學研發聯盟)、IEEE台北分會和IEEE台南分會共同舉辦的,旨在強化我國在半導體與IC科技領域的國際連結與人才交流,讓全球學生、青年專業人士和工程女性與全球領先的產業、學術和研究專業人士建立橋樑,以提升臺灣前瞻學術人才與成果的國際能見度,有鑑於當前輕量化人工智慧 (Lightweight AI) 技術的快速發展及其在各產業的廣泛應用,特舉辦一場聚焦於此關鍵技術的國際型研討會。
The 1st TIARA-IEEE SYW Seminar in Taiwan is a landmark event focused on “Innovation for Lightweight AI: Technology and Applications”. This hybrid seminar aims to bridge global Students, Young Professionals, and Women in Engineering with leading industry, academia, and research professionals worldwide.
Co-organized by TIARA (Taiwan Industry-Academia Research Alliance), IEEE Taipei Section, and IEEE Tainan Section, this seminar strengthens partnerships, builds a vital talent platform, and enhances Taiwan’s global visibility in the critical domains of semiconductors, IC design, and AI.
• 活動時間:2025年10月16日(星期四)9:30 – 12:30(9:00起開始報到)
• 活動地點:台北國際會議中心TICC 3F 南軒廳 (採實體+線上直播並行之混合模式)
• Date & Time: October 16, 2025 (Thursday);9:30 am to 12:30 pm (Registration period:9 am to 9:30 am)
• Venue: South Lounge, 3F, Taipei International Convention Center (TICC), Taiwan
• Format: Hybrid (Onsite & Online)
• 活動議程 Detailed Agenda (Tentative)
※本活動全程以英文進行。 The seminar will be held in English.
Time | Course | Guests/Speakers |
09:00 | Registration (on-site) | |
09:30 | Opening Remark / Group Photo | |
10:00 | The YP Session(2 talks each 20 mins) | – Dr. Saaveethya Sivakumar, Curtin Univ. Malaysia (inviting)- Dr. C.-T. Huang (黃朝宗), Professor, National Tsing-Hua University |
10:40 | Break | |
11:00 | The WIE Session(2 talks each 20 mins) | – Dr. Aishwarya Bandla, Manager, Paxman Scalp Cooling- Dr. W.-C. Tu (涂維珍), Professor, National Cheng Kung University |
11:40 | The Student Session(2 talks each 20 mins) | – Chamika Sudusinghe, Ph.D. Student, UIUC(online) – Dr. J.-W. Su (蘇建維), Staff Engineer, Industrial Technology Research Institute |
12:20 | Closing Remark |
活動時間地點 / Time Slots:
輕量化AI技術與半導體應用創新國際研討會/Innovation for Lightweight AI: Technology and Applications(實體 Onsite) | 2025/10/16 09:30 ~ 12:30 | 臺北市信義區信義路五段1號 |
輕量化AI技術與半導體應用創新國際研討會/Innovation for Lightweight AI: Technology and Applications(線上Online) | 2025/10/16 09:30 ~ 12:30 | 線上活動 |
報名費用及截止日期 / Registration Info:
輕量化AI技術與半導體應用創新國際研討會/Innovation for Lightweight AI: Technology and Applications(實體 Onsite) | 0 | 2025/09/10 00:00 ~ 2025/10/10 23:59 | 80 |
輕量化AI技術與半導體應用創新國際研討會/Innovation for Lightweight AI: Technology and Applications(線上Online) | 0 | 2025/09/10 00:00 ~ 2025/10/10 23:59 | 200 |
活動聯絡人 / Contact Us:
TIARA tiaratwic@gmail.com +886-35912777
IEEE Taipei Section:
o Email: ie3taipeisection@gmail.com
o Phone: +886-35712121 ext.54484 / 31590
IEEE Tainan Section:
o Email: tainansection.ieee@gmail.com
o Phone: +886-62757575 ext.62552
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